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  • Gold recovery from ICs and PCBs

    Hey people,

    I spend a lot of time taking photos of silicon dies (example attached).
    The process of extracting the silicon die involves the use of nitric and sulphuric acid.
    After a few months I have noticed that I am starting to build a small collection of gold in the bottom of my beakers.

    Questions I have:
    The nitric and sulfuric acid solutions get contaminated after a few uses and become less effective. These solutions are still perfectly fine for gold recovery from PCBs etc...
    I was wondering if anyone would mind sharing their procedure for gold precipitation?
    After getting gold powder, how to I get this down to a gold bead?
    Inside Secure Picopass iCLASS 2K die IC215HA.

  • #2
    More photos